PCB英文術(shù)語(yǔ)整理

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1、b/電電路路板板朮朮語(yǔ)語(yǔ)總總整整理理 A *A*Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹(shù)脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(試驗(yàn)).Acceleration速化反應(yīng).Accelerator 加速劑,速化劑.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy準(zhǔn)確度.Acid Number(Acid Value)酸值.Acoustic Microscope(AM)感音

2、成像顯微鏡.Acrylic壓克力(聚丙烯酸樹(shù)脂).Actinic Light(or Intensity,or Radiation)有效光.Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動(dòng)零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進(jìn)劑.Adhesive膠類(lèi)或接著劑.1Admittance導(dǎo)納(阻抗的倒數(shù)).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.Air Inclusi

3、on氣泡夾雜.Air Knife風(fēng)刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑.Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環(huán)境溫度.Amorphous無(wú)定形,非晶形.Amp-Hour安培小時(shí).Analog Circuit/Analog Signal 類(lèi)比電路/類(lèi)比訊號(hào).Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal 韌化(退火).Annular Ring孔環(huán).Anode陽(yáng)極.Anode Sludg

4、e陽(yáng)極泥.Anodizing陽(yáng)極化.ANSI美國(guó)標(biāo)準(zhǔn)協(xié)會(huì).Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動(dòng)光學(xué)檢驗(yàn).Apertures開(kāi)口,鋼版開(kāi)口.AQL品質(zhì)允收水準(zhǔn).2AQL(Acceptable Quality Level)允收品質(zhì)水準(zhǔn).Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器.Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動(dòng)電測(cè)設(shè)備.Attenuation訊號(hào)衰減.Autoclave壓力鍋.Axial-le

5、ad軸心引腳.Azeotrope共沸混合液.*B*B*Back Light(Back Lighting)背光法.Back Taper反錐斜角.Backpanels,Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines 平衡式傳輸線.Ball Grid Array球腳陣列(封裝).Bandability彎曲性.Banking Agent護(hù)岸劑.Bare Chip Assembly裸體晶片組裝.Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.3Baume波美度(凡液體比重比水重則 Be=145-

6、(145Sp.Gr)凡液體比重比水輕則 Be=140(Sp.Gr-130)*Sp.Gr 為比重即同體勣物質(zhì)對(duì)純水1g/cm的比值).Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測(cè)試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil雙階式鋼板.Binder粘結(jié)劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開(kāi).Bleack 漂洗.Bleeding溢流.Blind Via Hole肓

7、通孔.Blister局部性分層或起泡.Block Diagram電路系統(tǒng)塊圖.Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍(lán)紋(錫面鈍化層).Blur Edge(Circle)模糊邊帶(圈).Bomb Sight彈標(biāo).Bond Strength結(jié)合強(qiáng)度.Bondability結(jié)合性.4Bonding Layer結(jié)合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結(jié)合線.Bow,Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425870下進(jìn)行熔接的

8、方式).Break Point顯像點(diǎn).Break-away Panel可斷開(kāi)板.Breakdown Voltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stageB階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process凸塊制程.Buoyancy浮力.Buried Via Hole埋導(dǎo)孔.Burn-in高溫加速老化試驗(yàn).Burning燒焦.Burr毛頭.Bus Bar匯電桿

9、.5Butter Coat 外表樹(shù)脂層.*C*C4 Chip JointC4晶片焊接.Cable電纜.CAD電腦輔助設(shè)計(jì).Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法.Capacitance電容.Capacitive Coupling電容耦合.Capillary Action毛細(xì)作用.Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment,Active活化炭處理.Card卡板.Card Cages/Card Racks電路板搆裝箱.Carlson Pin卡氏定位稍.Carrier載體.Cartridge濾心.Cast

10、allation堡型勣體電路器.Catalyzed Board,Catalyzed Substrate催化板材.Catalyzing催化.Cathode陰極.Cation陰向離子,陽(yáng)離子.Caul Plate隔板.Cavitation空泡化 半真空.Center-to-Center Spacing中心間距.Ceramics陶瓷.Cermet陶金粉.6Certificate証明書(shū).CFC氟氫碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學(xué)研磨.Chemica

11、l Resistance抗化性.Chemisorption化學(xué)吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG).Chisel鑽針的尖部.Chlorinated Solvent含氯溶劑,氯化溶劑.Circumferential Separation環(huán)狀斷孔.Clad/Cladding披覆.Clean Room無(wú)塵室.Cleanliness清潔度.Clearance余地,余環(huán).Clinched Lead Terminal緊箝式引腳.Clinched-wire Through Connect

12、ion通孔彎線連接法.Clip Terminal繞線端接.Coat,Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹系數(shù).Co-Firing共繞.7Cold Flow冷流.Cold Solder Joint冷焊點(diǎn).Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯(cuò)離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Compo

13、sites,(CEM-1,CEM-3)復(fù)合板材.Condensation Soldering凝熱焊接,液化放熱焊接.Conditioning整孔.Conductance導(dǎo)電.Conductive Salt導(dǎo)電鹽.Conductivity導(dǎo)電度.Conductor Spacing導(dǎo)體間距.Conformal Coating貼護(hù)層.Conformity吻合性,服貼性.Connector連接器.Contact Angle接觸角.Contact Area接觸區(qū).Contact Resistance接觸電阻.Continuity連通性.Contract Service協(xié)力廠,分包廠.Controlled

14、 Depth Drilling定深鑽孔.Conversion Coating 轉(zhuǎn)化皮膜.Coplanarity共面性.8Copolymer共聚物.Copper Foil銅皮.Copper Mirror Test銅鏡試驗(yàn).Copper Paste銅膏.Copper-Invar-Copper(CIC)綜合夾心板.Core Material內(nèi)層板材,核材.Corner Crack 通孔斷角.Corner Mark板角標(biāo)記.Counterboring方型擴(kuò)孔.Countersinking錐型擴(kuò)孔.Coupling Agent 偶合劑.Coupon,Test Coupon板邊試樣.Coverlay/Co

15、vercoat表護(hù)層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.Crossection Area截面積.Crosshatch Testing十字割痕試驗(yàn).Crosshatching十字交叉區(qū).Crosslinking,Crosslinkage交聯(lián),架橋.Crossover越交,搭交.Crosstalk雜訊,串訊.Crystalline Melting Point晶體熔點(diǎn).C-Stage C階段.Cure硬化,熟化.Current Density電流密度.Current-Carrying Capability載流能力.9Curtain Coating濂塗法.*D*Da

16、isy Chained Design菊瓣設(shè)計(jì).Datum Reference基準(zhǔn)參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長(zhǎng).Denier丹尼爾(是編織紡織所用各種紗類(lèi)直徑單位,定義9000米紗束所具有的重量(以克米計(jì)).Densitomer透光度計(jì).Dent凹陷.Deposition 皮膜處理.Desiccat

17、or干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機(jī).Developing顯像.Deviation偏差.Device電子元件.Dewetting縮錫.D-glassD玻璃.10Diaze Film偶氮棕片.Dichromate重鉻 酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質(zhì).Dielectric Breakdown Voltage 介質(zhì)崩潰電壓.Dielectric Constant介

18、質(zhì)常數(shù).Dielectric Strength介質(zhì)強(qiáng)度.Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法.Diffusion Layer擴(kuò)散層.Digitizing數(shù)位化.Dihedral Angle雙反斜角.Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極,雙極.Direct/Indirect Stencil直接/間接版膜.Direct Emulsion直接乳膠.Direct Pla

19、ting直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復(fù)線板.Dish Down碟型下陷.11Dispersant分散劑.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受擾焊點(diǎn).Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In/Drag Out帶進(jìn)/帶出.Drag Soldering拖焊.Drawbridging吊橋效應(yīng).Drift

20、漂移.Drill Facet鑽尖切削面.Drill Pointer鑽針重磨機(jī).Drilled Blank已鑽孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接.Ductility展性.Dummy Land假焊墊.Dummy,Dummying假鍍(片).Durometer橡膠硬度計(jì).DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動(dòng)態(tài)軟板.*E*E-Beam(Electron Beam)電子束.12Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connecto

21、r板邊(金手指)承接器.Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測(cè)試.EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級(jí)玻璃.Elastomer彈性體.Electric Strength(耐)電性強(qiáng)度.Electrodeposition電鍍.Electro-deposition Photoresist 電著光阻,電泳光阻.Electroforming電鑄.Electroless-Deposition無(wú)電鍍.Electrolytic Tough Pitch電解銅.Electrolytic-Cleaning電解

22、清洗.Electro-migration電遷移.Electro-phoresis電泳動(dòng),電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation 延伸性,延伸率.Embossing凸出性壓花.EMF(Electromotive Force)電動(dòng)勢(shì).EMI(Electromagnetic Interference)電磁干擾.Emulsion乳化.Emulsion Side藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.13End Tap封頭.Entek有機(jī)護(hù)銅處理.Entrapment夾雜物.Entry Material蓋

23、板.Epoxy Resin環(huán)氧樹(shù)脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.Etching Indicator蝕刻指標(biāo).Etching Resist蝕刻阻劑.Eutetic Composition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*F*Fabric綱布.Face Bonding反面朝下結(jié)合.Failure故障.Fan Out Wiring/Fan In Wiring 扇出布線/扇入布線.Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強(qiáng)度.Fault缺陷.Fault Plane斷

24、層面.Feed Through Hole導(dǎo)通孔.Feeder 進(jìn)料器.Fiber Exposure玻纖顯露.Fiducial Mark基準(zhǔn)記號(hào).14Filament纖絲.Fill緯向.Filler填充料.Fillet內(nèi)圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過(guò)濾器.Fine Line細(xì)線.Fine Pitch密腳距,密線距,密墊距.Fineness粒度,純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產(chǎn)品.First Pass-Yield初檢良品率.Fixture夾具

25、.Flair刃角變形.Flame Point自燃點(diǎn).Flame Resistant耐燃性.Flammability Rate燃性等級(jí).Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡(luò).Flat Cable扁平排線.Flat Pack扁平封裝(之零件).Flatness平坦度.Flexible Printed Circuit(FPC)軟板.Flexural Failure撓曲損壞.15Flexural Module彎曲模數(shù),抗撓性模數(shù).Flexural Strength抗撓強(qiáng)度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Pri

26、nt覆墨沖程印刷.Flow Soldering(Wave Soldering)流焊.Fluorescence熒光.Flurocarbon Resin碳氟樹(shù)脂.Flush Conductor嵌入式線路 ,貼平式 導(dǎo)體.Flush Point閃火點(diǎn).Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print(Land Pattern)腳墊.Foreign Material 外來(lái)物,異物.Form-to-List布線說(shuō)明清單.Four Point Twisting四點(diǎn)扭曲法.Free Radical自由基.

27、Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.16 *G*G-10由連續(xù)玻纖所織成的玻纖布與 環(huán)氧樹(shù)脂粘結(jié)劑所復(fù)合成的材料.Gage,Gauge量規(guī).Gallium Arsenide(GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動(dòng)次序).Galvanizing鍍鋅.GAP第一面分離,長(zhǎng)刃斷開(kāi).Gate Array閘

28、列,閘極陣列.Gel Time膠化時(shí)間.Gelation Particle膠凝點(diǎn).Gerber Data,Gerber File格博檔案(是美商Gerber公司專(zhuān)為PCB面線路 圖形與孔位,所發(fā)展一系列完整的軟體檔案).Ghost Image陰影.Gilding鍍金(現(xiàn)為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging,Groove玻纖突出/挖破.Glass Transition Temperature,Tg玻璃態(tài)轉(zhuǎn)化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測(cè)試法.Glycol(E

29、thylene Glycol)乙二醇.Golden Board測(cè)試用標(biāo)準(zhǔn)板.Grain Size結(jié)晶粒度.Grass Leak 大漏.Grid標(biāo)準(zhǔn)格.Ground Plane/Earth Plane接地層.17Ground Plane Clearance接地空環(huán).Guide Pin導(dǎo)針.Gull/Wing Lead鷗翼引腳.*H*Halation環(huán)暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC氟碳化物的一種商品名.Hard Anodizing硬陽(yáng)極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Harde

30、ner(Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point(Temp)熱變形點(diǎn)(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導(dǎo)熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter(HEPA)高效空氣塵粒過(guò)瀘機(jī)

31、.Hipot Test 高壓電測(cè).Hi-Rel高度靠度.18Hit 擊(鑽孔時(shí)鑽針每一次刺下的動(dòng)作).Holding Time停置時(shí)間.Hole Breakout孔位破出.Hole Counter數(shù)孔機(jī).Hole Density孔數(shù)密度.Hole Preparation通孔準(zhǔn)備.Hole Pull Strength孔壁強(qiáng)度.Hole Void破洞.Hook 切削刀緣外凸.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風(fēng)手焊.HTE(High Temperature Elongation)高溫延伸性.Hull Cell哈氏

32、槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗(yàn).Hydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(guò)(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*I*I.C.Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉(zhuǎn)移.Immersion Plating浸鍍.19Impedance阻抗.Impedance Match阻抗匹配.Impregnate含

33、浸.In-Circuit Testing組裝板電測(cè).Inclusion異物,夾雜物.Indexing Hole基準(zhǔn)孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert,Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.InterFace介面.Interconnection互連.Intermetallic Compound(IMC)介面共化物.Internal Stress內(nèi)應(yīng)力.Interposer互邊導(dǎo)

34、電物.Interstitial Via-Hole(IVH)局部層間導(dǎo)通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹(shù)脂.Ion Migration離子遷移.Ionizable(Ionic)Contaimination 離子性污染.Ionization游離,電離.Ionization Voltage(Corona Level)電離化電壓(電纜內(nèi)部狹縫空氣中,引起其 電離所施加之最小電壓).IPC美國(guó)印刷電路板協(xié)會(huì).20Isolation隔離性,隔絕性.*J*JEDEC(Joint Elect

35、ronic Device 聯(lián)合電子元件工程委員會(huì).Engineering Council)J-LeadJ型接腳.Job Shop專(zhuān)業(yè)工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時(shí)供應(yīng),及時(shí)出現(xiàn).*K*Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金為 100%的鈍金.Kauri-Butanol Value考立丁醇值(簡(jiǎn)稱(chēng)K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤(pán).Kiss Pressure吻壓,低壓.Knoop Hardness努普硬

36、度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*L*Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結(jié)搆.21Laminate Void板材空洞.Laminate(s)基板.Lamination Void壓合空洞.Laminator壓膜機(jī).Land孔環(huán)焊墊,表面焊墊.Landless Hole無(wú)環(huán)通孔.Laser Direct Imaging(LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(L

37、PG),Laser Photoplotter雷射曝光機(jī).Laser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出.Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標(biāo)記.Leveling整平.Lifted Land孔環(huán)(焊墊)浮起.Ligand錯(cuò)離子附屬體.Light Emitting Diodes(LED)發(fā)光二極體.Light Integrator光能累積器.Light Int

38、ensity光強(qiáng)度.Limiting Current Density極限電流密度.Liquid Crystal Display(LCD)液晶顯示器.22Liquid Dielectrics液態(tài)介質(zhì).Liquid Photoimagible Solder Mask,(LPSM)液態(tài)感光防焊綠漆.Local Area Network區(qū)域性網(wǎng)路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent(TanDK)損失正切.Lot Size批量.Luminance發(fā)光強(qiáng)度.Lyophilic親水性膠體.*M*Macro-Throwing Pow

39、er巨觀分布力.Major Defect主要(嚴(yán)重)缺點(diǎn).Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標(biāo)記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質(zhì)量輸送.Master Drawing主圖.Mat蓆(用于CEM-3(Composite Epoxy Material)的 復(fù)合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).Mealing泡點(diǎn).Mean Time To Failure(MTTF)故障前可用之平均時(shí)數(shù).Measling白

40、點(diǎn).Mechanical Stretcher機(jī)械式張網(wǎng)機(jī).23Mechanical Warp機(jī)械式纏繞.Mechanism機(jī)理.Membrane Switch薄膜開(kāi)關(guān).Meniscograph Test弧面狀沾錫試驗(yàn).Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數(shù).Metal Halide Lamp 金屬鹵素?zé)?Metallization金屬 化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子.Microetching微蝕.Microsectio

41、ning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線.Microthrowing Power微分布力.Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環(huán)下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向.Misregistration 對(duì)不準(zhǔn)度.Mixed Componmt Mounting Technology混合零件之組裝技術(shù).Modem調(diào)變及解調(diào)器.24Modification修改.Modu

42、le模組.Modulus of Elasticity彈性系數(shù).Moisture and Insulation Resistance Test溼氣與絕緣電阻試驗(yàn).Mold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機(jī)板,母板.Moulded Circuit模造立體電路機(jī).Mounting Hole安裝孔.Mounting Hole組裝孔,機(jī)裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現(xiàn)不規(guī)則缺口).Multi-Chip-Module(MCM)多晶片芯片模組.Multiwiring Board(or Discrete Wiring B

43、oard)復(fù)線板.*N*N.C.數(shù)值控制.Nail Head釘頭.Near IR近紅外線.Negative負(fù)片,鑽尖的第一面外緣變窄.Negative Etch-back反回蝕.Negative Stencil負(fù)性感光膜.Negative-Acting Resist負(fù)性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環(huán).Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine(NMP)N-甲基四氫嗶咯.25Noble Metal Paste貴金屬印膏.Node節(jié)點(diǎn).Nodule節(jié)瘤.Nomencleature標(biāo)示文字符號(hào)

44、.Nominal Cured Thickness標(biāo)示厚度.Non-Circular Land非圓形孔環(huán)焊墊.Non-flammable非燃性.Non-wetting不沾錫.Normal Concentration (Strength)標(biāo)準(zhǔn)濃度,當(dāng)量濃度.Normal Distribution常態(tài)分布.Novolac酯醛樹(shù)脂.Nucleation,Nucleating核化.Numerical Control數(shù)值控制.Nylon尼龍.*O*Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)無(wú)氧高導(dǎo)電銅

45、.Ohm歐姆.Oilcanning蓋板彈動(dòng).OLB(Outer Lead Bond)外引腳結(jié)合.Oligomer寡聚物.Omega Meter離子污染檢測(cè)儀.Omega Wave振盪波.On-Contact Printing密貼式印刷.Opaquer不透明劑,遮光劑.Open Circuits斷線.26Optical Comparater光學(xué)對(duì)比器(光學(xué)放大器.)Optical Density光密度.Optical Inspection光學(xué)檢驗(yàn).Optical Instrument光學(xué)儀器.Organic Solderability Preservatives(OSP)有機(jī)保焊劑.Osmosi

46、s滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側(cè)出.Output產(chǎn)出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點(diǎn)分離.Overpotantial(Over voltage)過(guò)電位,過(guò)電壓.Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*P*Packaging封裝,搆裝.Pad焊墊,圓墊.Pad Master圓墊底片.Pads Only Board唯墊板.Palladium鈀.Panel制程板.Panel Plating全板鍍銅.Panel Process全板電鍍法.Paper

47、 Phenolic紙質(zhì)酚醛樹(shù)脂(板材).Parting Agent脫膜劑.Passivation鈍化,鈍化外理.27Passive Device(Component)被動(dòng)元件(零件)Paste膏,糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak Voltage峰值電壓.Peel Strength抗撕強(qiáng)度.Periodic Reverse(PR)Current 周期性反電流.Peripheral周邊附屬設(shè)備.Permeability透氣性,導(dǎo)磁率.Permittivity誘電率,透電率.pH Value酸堿值.Phase相.P

48、hase Diagram相圖.Phenolic酚醛樹(shù)脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光啟始劑.Photomask光罩.Photoplotter,Plotter光學(xué)繪圖機(jī).Photoresist光阻.Photoresist Chemical Machinning(Milling)光阻式化學(xué)(銑刻)加工.Phototool底片.Pick and Place拾取與放置.Piezoelectric壓電性.Pin 插腳,插梢,插針.Pin Grid Array(PGA)矩陣式針腳對(duì)裝.Pinhole針孔.28Pink

49、 Ring粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點(diǎn).Plain Weave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.Platen熱盤(pán).Plating鍍.Plotting標(biāo)繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.Pneumatic Stretcher氣動(dòng)拉伸器.Pogo Pin伸縮探針.Point 鑽尖.Point Angle鑽尖面.Point Source Light點(diǎn)狀光源.Poise泊.粘滯度單位=1dyne*sec/cm2.Polar Solvent極性溶劑.Polarity電極性.Pol

50、arization分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類(lèi)薄片.Polymer Thick Film(PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.Popcorn Effect爆米花效應(yīng).29Porcelain瓷材,瓷面.Porosity Test疏孔度試驗(yàn).Positive Acting Resist正性光阻劑.Post Cure后續(xù)硬化,后烤.Post Separation后期分離,事后公離.Pot Life運(yùn)用期,鍋中壽命.Potting鑄封,模封.Power Supply電源供應(yīng)器.Preform 預(yù)制品

51、.Preheat預(yù)熱.Prepreg膠片,樹(shù)脂片.Press Plate鋼板.Press-Fit Contact擠入式接觸.Pressure Foot 壓力腳.Pre-tinning預(yù)先沾錫.Primary Image線路成像.Print Through壓透,過(guò)度擠壓.Probe探針.Process Camera制程用照像機(jī).Process Window操作范圍.Production Master生產(chǎn)底片.Profile輪廓,部面圖,升溫曲線圖稜線.Propagation傳播.Propagation Delay傳播延遲.Puddle Effect水坑效應(yīng).Pull Away拉離.Pulse P

52、lating脈沖電鍍法.Pumice Powder 浮石粉.30Punch沖切.Purge,Purging淨(jìng)空,淨(jìng)洗.Purple Plague紫疫(金與鋁的共化物層).Pyrolysis熱裂解,高溫分解.*Q*Quad Flat Pack(QFP)方扁形封裝體.Qualification Agency資格認(rèn)証機(jī)搆.Qualification Inspection資格檢驗(yàn).Qualified Products List合格產(chǎn)品(供應(yīng)者)名單.Qualitative Analysis定性分析.Quality Conformance Test Circuitry(Coupon)品質(zhì)符合之試驗(yàn)線路(

53、樣板).Quantitative Analysis定量分析.Quench 淬火,驟冷.Quick Disconnect快速接頭.Quill緯紗繞軸.*R*Rack 掛架.Radial Lead放射狀引腳.Radio Frequency Interference(RFI)射頻干擾.Rake Angle摳角,耙角.Rated Temperature,Voltage額定溫度,額定電壓.Reactance電抗.Real Estate底材面,基板面.Real Time System 即時(shí)系統(tǒng).Reclaiming再生,再制.Rediometer輻射計(jì),光度計(jì).Reel to Reel卷輪(盤(pán))式操作.R

54、eference Dimension參考尺度.31Reference Edge參考邊緣.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark對(duì)準(zhǔn)用標(biāo)記.Registration對(duì)準(zhǔn)度.Reinforcement補(bǔ)強(qiáng)物.Rejection剔退,拒收.Relamination(Re-Lam)多層板壓合.Relaxation松弛.緩和.Relay繼電器.Release Agent,Release Sheets脫模劑,離模劑.Reliability可靠度,可信度.Relief Angle浮

55、角.Repair修理.Resin Coated Copper Foil背膠銅箔.Resin Content膠含量,樹(shù)脂含量.Resin Flow膠流量,樹(shù)脂流量.Resin Recession樹(shù)脂下陷.Resin Rich Area 多膠區(qū),樹(shù)脂豐富區(qū).Resin Smear膠(糊)渣.Resin Starve Area缺膠區(qū),樹(shù)脂缺乏區(qū).Resist阻膜,阻劑.Resistivity電阻系數(shù),電阻率.Resistor電阻器,電阻.Resistor Drift電阻漂移.Resistor Paste電阻印膏.32Resolution解像,解像度,解析度.Resolving Power解析(像)力

56、,分辨力.Reverse Current Cleaning反電流(電解)清洗.Reverse Etchback反回蝕.Reverse Image負(fù)片影像(阻劑).Reverse Osmosis(RO)反(逆滲透).Reversion反轉(zhuǎn),還原.Revision修正版.改訂版.Rework(ing)重工,再加工.Rhology流變學(xué),流變性質(zhì).Ribbon Cable圓線纜帶.Rigid-Flex Printed Board硬軟合板.Ring 套環(huán).Rinsing水洗,沖洗.Ripple紋波(指整流器所輸出電流中不穩(wěn)定成分).Rise Time上升時(shí)間.Roadmap 線路與零件之布局圖.Rob

57、ber輔助陰極.Roller Coating輥輪塗布.Roller Coating滾動(dòng)塗布法.Roller Cutter輥切機(jī).Roller Tinning輥錫法,滾錫法.Rosin松香.Rotary Dip Test擺動(dòng)沾錫試驗(yàn).Routing切外型.Runout偏轉(zhuǎn),累勣距差.Rupture迸裂.*S*33Sacrificial Protection犧牲性保護(hù)層.Salt Spray Test鹽霧試驗(yàn).Sand Blast噴砂.Saponification皂化作用.Saponifier皂化劑.Satin Finish緞面處理.Scaled Flow Test比例流量實(shí)驗(yàn).Schemetic

58、 Diagram電路概略圖.ScoringV型刻槽.Scratch刮痕.Screen Printing綱版印刷.Screenability綱印能力.Scrubber磨刷機(jī),磨刷器.Scum透明殘膜.Sealing封孔.Secondary Side第二面.Seeding下種.Selective Plating選擇性電鍍.Self-Extinguishing自熄性.Selvage布邊.Semi-Additive Process半加成制程.Semi-Conductor半導(dǎo)體.Sensitizing敏化.Separable Component Part可分離式零件.Separator Plate隔板,

59、鋼板.Sequential Lamination接續(xù)性壓合法.Sequestering Agent螯合劑.Shadowing陰影,回蝕死角.34Shank鑽針柄部.Shear Strength 抗剪強(qiáng)度.Shelf Life儲(chǔ)齡.Shield遮蔽.Shore Hardness蕭氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall側(cè)壁.Siemens電阻值.Sigma(Standard Deviation)標(biāo)準(zhǔn)差.Signal訊號(hào).Silane硅烷.Silica Gel硅膠砂.Silicon硅.Silicone硅銅.Silk Screen綱版印刷,絲綱印

60、刷.Silver Migration銀遷移.Silver Paste 銀膏.Single-In-Line Package(SIP)單邊插腳封裝體.Sintering燒結(jié).Sizing上膠,上漿.Sizing上漿處理.Skin Effect集膚效應(yīng)(高頻下,電流在傳遞時(shí)多集中在導(dǎo)體 表面,使得道線內(nèi)部通過(guò)電流甚少,造成內(nèi)部導(dǎo)體 浪費(fèi),并也使得表面導(dǎo)體部分電阻升高.Skip Printing,Skip Plating漏印,漏鍍.Skip Solder 缺錫,漏焊.35Slashing漿經(jīng).Sleeve Jint套接.Sliver邊絲,邊余.Slot,Slotting槽口.Sludge於泥.Slum

61、p塌散.Slurry稠漿,懸浮漿.Small Hole小孔.Smear膠渣.Smudging錫點(diǎn)沾污.Snap-off彈回高度.Socket插座.Soft Contact輕觸.Soft Glass 軟質(zhì)玻璃(鉛玻璃).Solder焊錫.Solder Ball錫球.Solder Bridging錫橋.Solder Bump 焊錫凸塊.Solder Column Package錫柱腳封裝法.Solder Connection焊接.Solder Cost焊錫著層.Solder Dam錫堤.Solder Fillet填錫.Solder Levelling噴錫,熱風(fēng)整平.Solder Masking(S

62、/M)防焊膜綠漆.Solder Paste錫膏.Solder Plug錫塞(柱).Solder Preforms預(yù)焊料.36Solder Projection焊錫突點(diǎn).Solder Sag 焊錫垂流物.Solder Side焊錫面.Solder Spatter濺錫.Solder Splash賤錫.Solder Spread Test散錫試驗(yàn).Solder Webbing錫綱.Solder Webbing錫綱.Solder Wicking滲錫,焊錫之燈芯效應(yīng).Solderability可焊性.Soldering軟焊,焊接.Soldering Fluid,Soldering Oil 助焊液,護(hù)焊油

63、.Solid Content固體含量,固形分.Solidus Line固相線.Spacing間距.Span跨距.Spark Over閃絡(luò).Specific Heat 比熱.Specification(Spec)規(guī)范,規(guī)格.Specimen樣品,試樣.Spectrophotometry分光光度計(jì)檢測(cè)法.Spindle主軸,鑽軸.Spinning Coating自轉(zhuǎn)塗布.Splay斜鑽孔.Spray Coating噴著塗裝.Spur底片圖形邊緣突出.Sputtering濺射.Squeege刮刀.37Stagger Grid蹣跚格點(diǎn).Stalagometer滴管式表面張力計(jì).Stand-off Te

64、rminals直立型端子.Starvation缺膠.Static Eliminator靜電消除器.Steel Rule Die(鋼)刀模.Stencil版膜.Step and Repeat逐次重覆曝光.Step Plating梯階式鍍層.Step Tablet階段式曝光表.Stiffener補(bǔ)強(qiáng)條(板).Stop Off防鍍膜,阻劑.Strain變形,應(yīng)變.Strand絞(指由許多股單絲集束并旋扭而成的絲束).Stray Current迷走電流,散雜電流(在電鍍槽系統(tǒng)中,其直流電 由整流器所提供,應(yīng)在陽(yáng)極板與被鍍件之間的匯 電桿與槽體液體中流通,但有時(shí)少部分電流也可能會(huì) 從槽體本身或加熱器上迷

65、走,漏失).Stress Corrosion應(yīng)力腐蝕.Stress Relief消除應(yīng)力.Strike預(yù)鍍.Stringing拖尾.Stripline條線.Stripper剝除液(器).Substractive Process減成法.Substrate底材.Supper Solder超級(jí)焊錫.Supported Hole(金屬)支助通孔.38Surface Energy表面能.Surface Insulation Resistance 表面絕緣電阻.Surface Mount Device 表面粘裝元件.Surface Mounting Technology(SMT)表面粘裝技術(shù).Surfac

66、e Resistivity表面電阻率.Surface Speed鑽針表面速度.Surface Tension表面張力.Surfactant表面潤(rùn)溼劑.Surge突流,突壓.Swaged Lead壓扁式引腳.Swelling Agents,Sweller膨松劑.Swimming 線路滑離.Synthetic Resin合成樹(shù)脂.*T*Tab接點(diǎn),金手指.Taber Abraser泰伯磨試器.Tackiness粘著性,粘手性.Tape Automatic Bonding(TAB)卷帶自動(dòng)結(jié)合.Tape Casting 帶狀鑄材.Tape Test撕膠帶試驗(yàn).Tape Up Master原始手貼片.Taped Components卷帶式連載元件.Taper Pin Gauge錐狀孔規(guī).Tarnish污化.Tarnish 污化,污著.Teflon鐵氟龍(聚4氟乙烯).Telegraphing浮印,隱印.Temperature Profile溫度曲線.39Template模板.Tensile Strength抗拉強(qiáng)度.Tensiomenter張力計(jì).Tenting蓋孔法.Terminal端子.T