電磁爐底座的CAD及其模具設計【含CAD圖紙+文檔】

壓縮包內含有CAD圖紙和說明書,均可直接下載獲得文件，所見所得，電腦查看更方便。Q 197216396 或 11970985

任 務 書 院（系）： 專業(yè)： 班 級： 學生： 學號： 一、畢業(yè)論文課題 電磁爐底座的CAD及其模具設計 二、畢業(yè)論文工作自 20xx 年 3 月 12 日起至 20xx 年 6 月 15 日止 三、畢業(yè)設計(論文)進行地點 教學一號樓西903 四、畢業(yè)設計(論文)的內容要求 (一) 設計的原始數(shù)據(jù) 原始數(shù)據(jù)（尺寸）根據(jù)給定的設計對象進行測量。 (二) 設計計算及說明部分內容 1.計算內容與方案確定 ⑴、設計對象的結構CAD ①、三維造型設計； ②、設計流程 先建立設計對象主控件；再將主控件拆分并細化造型； 對各零部件進行結構設計使之滿足于制造； ⑵、電磁爐底座的模具設計 ①、成形零件設計：動、定模型腔尺寸的計算和布置； ②、結構系統(tǒng)設計計算：頂出機構、抽芯機構、冷卻、澆注、排氣系統(tǒng)等尺寸 的計算與布置； ③、強度設計和結構草圖設計及各部件的強度校核； 2. 設計內容 ⑴、Pro/E環(huán)境下設計對象的結構CAD即三維建模； ⑵、Pro/E環(huán)境下設計對象的模具設計； ⑶、Pro/E環(huán)境下或其它CAE軟件下進行成型分析。 (三) 設計圖紙及圖形文件 ⑴、設計對象的裝配圖： 1張(A0或A1) ⑵、模具裝配圖： 1張(A0或A1) ⑶、零件圖： 2～3張主要零件(A1) ⑷、設計中的圖形文件 用光盤保存 (四) 編寫設計（論文）說明書 不少于1.0萬字，用計算機排版并輸出。 (五) 參考文獻 1、塑料成型工藝及模具設計 湖南大學 葉久新編著 2、 Pro/ENGINEER Wildfire3.0 王玉甲等編著 3、 機械工程材料 西安交通大學 沈蓮主編 4、 塑料工藝與模具設計 湖南大學出版社 沈言錦編著 5、 機械制造基礎 電子工業(yè)出版社 祈紅志編著 6、 模具材料 機械工業(yè)出版社 高為國主編 (六) 附屬專題 1、專題外文翻譯 檢索與閱讀與設計題目相關的外文資料，并書面翻譯不少于3000字的外文資料。 指導教師 接受論文任務開始執(zhí)行日期 20xx 年 3 月 12 日 學生簽名 附注： 1、此任務書應附于所完成的畢業(yè)設計說明書中。 2、編寫設計說明書要求： （1）編寫格式：參照設計任務書規(guī)定的內容和順序，進行設計計算及說明書編寫，說明書前應附有目錄，后面應有參考資料及文獻一覽表，以及本人對設計的總結及評價。 （2）文字表達部分：要求說明書一律用計算機打印，紙張采用學校統(tǒng)—規(guī)格尺寸，文字說明力求條理清楚，圖文并茂，繪制的草圖不允許徒手進行，必須用繪圖工具繪制。 （3）設計計算要求：所采用的公式、數(shù)據(jù)、圖的來源等必須交待清楚，單位符號盡量統(tǒng)一，標注要說明，計算過程應條理分明，力求直觀、筒單明暸、計算結果準確、符號交待清楚，計算數(shù)據(jù)有匯總分析，重要計算內容附有必要的插圖和表格歸納。 （4）繪圖要求：所繪制的圖紙應符合國家標準，各視圖反映正確、齊全，圖面整潔、布置合理、比例準確。圖中標題欄填寫準確得當，技術要求符合有關技術標準，且設計者必須全面了解圖紙技術要求的內容和規(guī)定。 譯文： Moldflow 模塑觀察 Moldflow模塑分析方法-為塑料模型加工程序深入分析和最優(yōu)化設立工業(yè)標準不但可以應用于簡單或者復雜的單孔,更可運用到多孔以及各式各樣的幾何形狀成型 Moldflow模塑觀察（MPI）軟件代表最全面的模擬，最優(yōu)化和檢驗塑料部分和成型設計的工具組。強大并容易上手，MPI提供了9中不同的能夠模擬9種不同的成型過程的模塊。 預先分析的優(yōu)點 為了防止在制造開始時出現(xiàn)問題引起的搞成本和時間的浪費，將部分幾何，原料選擇，模具設計和過程條件的聯(lián)合作用在生產(chǎn)時作為一個整體來考慮是有必要的。用預先分析工具來模擬注射成型過程，公司可以在生產(chǎn)前進行設計時評估和最優(yōu)化各個變量的互相影響的效應，在生產(chǎn)開始前，變化的成本是最小的，但是變化的影響是最大的。 運用MPI分析，可以模擬在有或沒有漏斗和光纜加固條件下用材料填充，包裝和冷卻熱塑性塑料模具過程，同時預測例如部分變形的過度成型現(xiàn)象。也可以模擬材料流程和反應成型的核心過程。 MPI不但提供了世界上最大的包括7800多種運用與塑料CAE分析的熱塑性塑料材料的數(shù)據(jù)庫，同時也包括熱固塑料，冷凍劑，模具材料和注射成型機器分析能力。 MPI 以其速度，精度和最多種的幾何設計，最豐富的與塑料成型有關的生產(chǎn)內容而得到各界的認可。 幾何寬度 由于幾何寬度都可運用，MPI模擬工具功能很強大。MPI能讓你直接分析傳統(tǒng)的盆腔中段平面有限成分網(wǎng)絡模型，運用MPI分析薄墻部分固體模型，運用 MPI/3D分析厚部分固體模。 傳統(tǒng)盆腔中段平面方法 盆腔中段平面濾網(wǎng)代表一個三維部分二維，平面表面與厚度物產(chǎn)被分配到這表面。用midplane網(wǎng)工程,最好當一部分是modeled是一項傳統(tǒng),薄壁注塑成型應用. 為了增加生產(chǎn)力,創(chuàng)造并分析這些模型, 利用MPI / midplane發(fā)生器可用于自動生成midplane網(wǎng)并指派適當?shù)膯卧穸纫源_保準確 分析結果. MPI /融合的解決方案 MPI /融合的解決方案是基于Moldflow的獨家專利的雙域?技術, 這是一個三維部分邊界或皮膚網(wǎng)在外面零件表面所得到的由一個共同的計算機輔助翻譯模型等為STL或IGES的格式. 這允許你直接分析CAD實體模型薄壁零件, 大大減少模型準備時間. 以便能讓你來分析更多設計迭代以及執(zhí)行更深入的分析. MPI/3D 解決方案 三維模擬幾何不符合標準的界定傳統(tǒng)薄壁設計.而MPI/3D辦法有堅實的四面體的有限元體積網(wǎng)是一套行之有效的技術解決方案。MPI/3D有行之有效厚扎實零件,如電子連接器,厚厚的結構組件和那些有極端的厚度變化的零件. 優(yōu)化整體解決方案的時間 整體解決時間包括兩種模型編制和分析的運行時間. 這些因素都高度依賴于復雜的零件和模具的設計以及用戶選定的分析方法. Moldflow產(chǎn)品為您提供范圍廣泛的軟件解決方案, 在最短的時間內應用在不同的項目，讓您能獲得最準確的結 模擬深度 MPI軟件提供的深入過程模擬工具用于預測和消除潛在的生產(chǎn)問題，找出最優(yōu)化部分設計，自動進行模具設計并成型。MPI分析提供全面的塑料成型過程范圍和熟練級的應用。 MPI/Synergy是支持所有MPI分析模塊的事前和時候處理者。MPI/Synergy提供所有功能的強大的工作流程和生產(chǎn)工具，這些功能包括提供功能完善的工作流程和強大生產(chǎn)力的工具,及所有模型驗證中必要的能力,建模,網(wǎng)格,網(wǎng)格編輯,職位設置,工作控制,并生成一個單一的方便操作的環(huán)境并能夠使結果可視化。 塑料流程模擬 MPI/Flow模擬灌裝階段的熱塑性塑料成型過程并預測流態(tài)的塑料。所以你可以確保零部件質量的承受能力，避免浪費。使用MPI/Flow,你可以優(yōu)化澆口位置,平衡澆注系統(tǒng),評價加工條件來確定一個健全塑造窗口 并確定正確的部分潛在缺陷. 你可以模擬創(chuàng)新應用包括插入overmolding雙鏡頭順序overmolding進程. 你也可以分析不同非均勻鑄模溫度,確定適合閥門時間序列 比較流經(jīng)熱與冷澆注系統(tǒng),并分析動態(tài)材料的應用. 選擇延長MPI/Flow的模擬能力比基本成型的更復雜熱塑性 MPI /流通 PI /天然氣模擬氣體輔助注射成型工藝,如氣體,通常是惰性氮,是注入聚合物. 天然氣驅動的聚合物通過模具來完成充填和創(chuàng)造網(wǎng)絡中空頻道 整個組件. 使用MPI /天然氣結果幫助確定位置聚合物和天然氣入口處 多少塑料注前注氣,把天然氣管道, 多大尺寸. MPI /氣 MPI /共注射模仿順序中,如皮膚的材料是注射一次, 其次是注射一種不同的核心物質. 你可以看到更優(yōu)化的材料,并洞見到動態(tài)變化的關系, 填充外部和芯材料. 利用成果的優(yōu)化組合兩種材料,同時獲得最大限度的整體性能/成本比的產(chǎn)品. Mold?ow Plastics Insight Mold?ow Plastics Insight? (MPI?) software represents the most comprehensive suite of de?nitive tools for simulating, analyzing, optimizing, and validating plastics part and mold designs. Powerful and easy to use, MPI offers nineteen distinct modules that can be used to simulate nine unique molding processes. The Benefits of Predictive Analysis To avoid the high costs and time delays associated with problems discovered at the start of manufacturing, it is necessary to consider the combined effects of part geometry, material selection, mold design and processing conditions on the manufacturability of a part. Using predictive analysis tools to simulate the injection molding process,companies can evaluate and optimize interactions among these variables during the design phases of a project before production begins, where the cost of change is minimal and the impact of the change is greatest. With MPI analyses, you can simulate the ?lling, packing and cooling phases of thermoplastics molding processes using materials with or without ?llers and ?ber reinforcements,as well as predict post-molding phenomena such as part warpage. You can also simulate material ?ow and cure of reactive molding processes. MPI also offers the world’s largest material database of its kind with more than 7,800 thermoplastic materials characterized for use in plastics CAE analysis, as well as thermoset materials, coolants and mold materials, and injection molding machine-speci?c analysis capabilities. MPI is highly acclaimed for its speed and accuracy and addresses the broadest range of design geometry types and manufacturing issues associated with plastics molding processes. MPI simulation tools are made all the more powerful because of the wide breadth of geometry types that can be used. MPI allows you to directly analyze traditional midplane ?nite-element mesh models, solid models of thin-wall parts using MPI/Fusion solvers, and solid models of thick parts using MPI/3D solvers. Traditional Midplane Solutions A midplane mesh represents a three-dimensional part with a two-dimensional, planar surface with a thickness property assigned to this surface. Using a midplane mesh works best when the part being modeled is a traditional, thin-walled injection molding application. To increase your productivity when creating and analyzing such models, the MPI/Midplane Generator can be used to automatically generate a midplane mesh and assign proper element thickness to ensure accurate analysis results. MPI/Fusion Solutions MPI/Fusion solutions are based on Mold?ow’s patented Dual Domain? technology, which represents a three-dimensional part with a boundary or skin mesh on the outside surfaces of the part obtained from a common CAD translation model such as STL or IGES format. This allows you to analyze CAD solid models of thin-walled parts directly, resulting in a signi?cant decrease in model preparation time. The time saved allows you to analyze more design iterations as well as perform more in-depth analyses. MPI/3D Solutions Using a proven solution technique based on a solid, tetrahedral ?nite-element volume mesh, MPI/3D solutions allow you to perform true, three-dimensional simulations on geometries that do not conform to the criteria de?ning traditional, thin-wall designs. MPI/3D works well with thick and solid parts such as electrical connectors, thick structural components, and those that have extreme thickness changes. Optimize Total Solution Time Total solution time includes both model preparation and analysis run time. These factors are highly dependent on complexity of part and mold design as well as user-selected analysis options. Mold?ow products offer you a wide range of software solutions so you can obtain the most accurate results possible in the shortest period of time for each unique application. Mold?ow Plastics Insight software provides in-depth process simulation tools so you can predict and eliminate potential manufacturing problems and optimize part design, mold design and the molding process itself. MPI analyses give you de?nitive solutions that address a comprehensive range of plastics molding processes and state-of-the-art process applications. MPI/Synergy is the pre- and post-processor that supports all MPI analysis modules. MPI/Synergy provides powerful work?ow and productivity tools with all of the necessary capabilities for modeling, meshing, mesh editing, model validation, job setup, job control, results visualization and report generation in a single, easy-to-use environment. Plastic Flow Simulations MPI/Flow simulates the ?lling and packing phases of the thermoplastics injection molding process to predict the ?ow behavior of plastic melts so you can ensure that parts of acceptable quality can be manufactured ef?ciently. Using MPI/Flow, you can optimize gate locations, balance runner systems, evaluate processing conditions to determine a robust molding window, and determine and correct potential part defects.You can simulate innovative applications including insert overmolding and two-shot sequential overmolding processes. You can also analyze the effects of non-uniform mold temperatures, determine optimized valve-gate timing sequences, compare ?ow through hot versus cold runner systems, and analyze Dynamic Feed applications. MPI/Gas simulates the gas-assisted injection molding process, where gas, usually inert nitrogen, is injected into the polymer melt. The gas drives the polymer through the mold cavity to complete mold ?lling and create a network of hollow channels throughout the component. Use MPI/Gas results to help determine where to position polymer and gas entrances, how much plastic to inject prior to gas injection, where to place gas channels, and how large to size them. MPI/Co-Injection simulates the sequential co-injection process, where a skin material is injected ?rst, followed by he injection of a different core material. You can view the advancement of the materials in the cavity and see the dynamic, changing relationship between skin and core materials as ?lling progresses. Use results to optimize the combination of wo materials while maximizing the overall performance/cost atio for the product. MPI/Injection Compression simulates processes where polymer injection and mold compression occur simultaneously or sequentially and allows you to program the compression phase to begin before, during, or after polymer injection using timer controls built into the software. Use results to comprehensively evaluate candidate materials, part design, mold design, and process conditions. MPI/MuCell simulates the microcellular (MuCell?) injection molding process, in which a supercritical ?uid such as carbon dioxide or nitrogen is mixed with molten polymer and injected into the mold to produce microcellular foam. With MPI/MuCell, you can evaluate the feasibility and bene?ts of using this process versus traditional injection molding. Additionally, you can optimize the part design and the process settings by reviewing the various analysis results. MPI/Design-of-Experiments lets you set up and perform a sequence of analyses automatically, varying the parameters you specify, such as mold and melt temperatures, injection time, packing pressure and time, and part thickness. The program automatically arranges the experiments and statistically analyzes the results to help you optimize processing parameters and ultimately, the molded part. Results include single-point quality indicators such as volumetric shrinkage, injection pressure, clamp force and ?ow-front temperature, as well as displays of ?ll time, pressure, and temperature distributions. MPI/Optim allows you to perform an injection molding machine-speci?c analysis, which takes into account the actual machine response time, maximum injection velocity, and the number of steps that can be programmed for velocity and pressure pro?les on the machine controller. Use the results to achieve uniform ?ow front velocity and temperature pro?les through the injection molding machine nozzle, the mold feed system, and the part Mold Cooling Simulations MPI/Cool provides tools for modeling mold cooling circuits, nserts, and bases around a part and analyzing the ef?ciency of the mold’s cooling system. MPI/Cool simulations allow users to optimize mold and cooling circuit design to achieve uniform part cooling, minimize cycle times, eliminate part warpage due to cooling factors, and decrease overall manufacturing costs. Structural Integrity Simulations MPI contains a broad range of simulation products speci?cally developed for predicting the structural integrity of injection-molded plastic parts. MPI/Warp predicts the shrinkage and warpage of plasticparts based on process-induced stresses. It is also possible to predict the spatial deviation of an injection mold core due to non-uniform pressure distribution. MPI/Warp results help you understand the causes of warpage, display where it will occur, and allow you to optimize your design, material choice and processing parameters to control part deformation before the mold is built. MPI/Fiber predicts the ?ber orientation due to ?ow in ?ber-?lled plastics and the resultant mechanical strength of the plastic/?ber composite. It is important to understand and control the orientation of ?bers within ?ber-?lled plastics to reduce shrinkage variations across the molded part to minimize or eliminate part warpage. MPI/Shrink predicts polymer shrinkage based on the effects of processing and grade-speci?c material data and offers a true prediction of linear shrinkage independent of warpage analysis. Because plastic parts shrink as they cool, it is essential to accurately account for this shrinkage in the design of the mold so that critical product tolerances can be met. MPI/Stress predicts the post-molding performance of plastic parts when subject to various forms of external loading. The analysis considers the effects of plastic ?ow during injection molding and the resultant mechanical properties on the component’s structural integrity. Reactive Molding Simulations MPI/Reactive Molding simulates the ?ow and curing othermoset resins in a variety of reactive molding processesincluding thermoset and rubber injection molding and RTM SRIM applications. Use results to evaluate manufacturabilityminimize cycle times, and optimize processing conditions. MPI/Microchip Encapsulation simulates the encapsulation of semi-conductor chips with reactive resins, including paddle shift and wire sweep predictions. Analysis results help you design the encapsulation package, tool, leadframe and wires, as well as optimize processing conditions, including mold temperature, ?lling time, ram speed pro?le, and curing time. MPI/Under?ll Encapsulation simulates the pressurized under?ll encapsulation process (also called ?ip-chip encapsulation) to predict the ?ow of the encapsulant material in the cavity, between the chip and the substrate. To install and run Mold?ow Plastics Insight software, your computer should have at minimum a 500-MHz processor with at least 2 GB of free disk space and 256 MB of RAM. Actual requirements to achieve optimal performance may increase signi?cantly depending on the size of models you are analyzing, the type of analysis and the number of simultaneous analyses being run.